Working Instruction.pdf

(955 KB) Pobierz
Working Instruction, Electrical
Working Instruction, Electrical
Applicable for W380, Z555
CONTENTS
1
2
3
Read this first! ........................................................................................ 2
Lead-free soldering ................................................................................ 3
BGA equipment reflow profiles............................................................. 5
3.1
3.2
3.3
General.................................................................................................. 5
Temperature Measurements ................................................................. 5
Reflow Profiles ...................................................................................... 6
Liquid Intrusion Indicator: ...................................................................... 7
System Connector Gaskets:.................................................................. 7
E1002 Bluetooth Shield Can: ................................................................ 8
X0616: Battery Connector ..................................................................... 9
X2600: System Connector .................................................................. 10
X2600: System Connector
Continued
................................................. 11
Revision History .................................................................................. 12
4
Replacement of components ................................................................ 6
4.1
4.2
4.3
4.4
4.5
4.6
4.7
1208-3979 1
©
Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1 Read this first!
•
Before you start replacing any components, make sure you have read and fully understood
the contents of section 2 and 3!
•
Also make sure you have access to the Mechanical Working Instruction and the Equipment
Lists described on the first page of section 4!
•
Use Electrostatic Discharge (ESD) equipment to avoid damaging the PBA.
•
Use gloves or finger cots to avoid contaminating the PBA with skin oil.
1208-3979 1
©
Sony Ericsson Mobile Communications AB
2(12)
Working Instruction, Electrical
2 Lead-free soldering
T
HIS PRODUCT IS MANUFACTURED WITH LEAD
-
FREE SOLDER
AND LEAD
-
FREE COMPONENTS
!
During electrical repair, it is critical to make sure that no lead is
introduced.
This symbol indicates that the product is lead- free.
The lead-free symbol is located on the PCB as shown.
A lead-free work area must be set up completely separated
from work areas that are used to make lead repairs. The lead-
free work area must also be clearly labeled with the lead free
symbol as shown in the adjacent picture. The items on this
desk must remain lead-free. They must be adequately labeled
to make their lead-free status clearly and easily recognized.
1208-3979 1
©
Sony Ericsson Mobile Communications AB
3(12)
Working Instruction, Electrical
Lead-free soldering
continued
LFS (lead-free solder) characteristics:
• High melting point (typically 217°C)
• Low wetting
• High surface tension
• Difficult to spread
• Recommended tip temperature = 370°C
W
HEN SERVICING
PBA
S THAT HAVE BEEN MANUFACTURED
WITH
LFS (
LEAD
-
FREE SOLDER
), LFS
MUST BE USED
!
I
F NOT
,
THERE IS A HIGH RISK OF UNRELIABLE SOLDERING
JOINTS
!
Lead-free solder joints are more difficult to inspect because they
do not have shiny surfaces like leaded solder joints. Also, lead-
free solder does not flow as well as leaded solder, so some of
the solder pad areas may remain exposed.
1208-3979 1
©
Sony Ericsson Mobile Communications AB
4(12)
Working Instruction, Electrical
3 BGA equipment reflow profiles
3.1
General
This section contains reflow profile recommendations for mobile phones and similar products.
They are just general recommendations and considerations have to be taken for every single product.
The solder is secondary but could also affect the parameters.
In this document one alloy is specified: SnAgCu (Lead free) melting point 217°C
3.2
Temperature Measurements
At least four probes should be used.
They should be placed on components with the highest and lowest thermal mass.
The probes shall be located in the beginning, in the middle and at the end of the board/panel.
It is recommended that the probes are soldered on the board, but glue and Kapton tape can be used.
At least one probe shall be placed in the air or on top of a component.
These values are strongly depending on the BGA replacement equipment.
A nozzle type will be chosen based on the outer size of the actual component.
Make sure the nozzle does not affect any nearby placed components.
T
HESE VALUES ARE RECOMMENDATIONS AND MAY HAVE TO BE CHANGED DEPENDANT ON THE TYPE OF
EQUIPMENT
!
T
HE MAXIMUM TEMPERATURE FOR ANY COMPONENT MUST NOT EXCEED
260°C!
1208-3979 1
©
Sony Ericsson Mobile Communications AB
5(12)

Plik z chomika:

Inne pliki z tego folderu:

Inne foldery tego chomika:

Zgłoś jeśli naruszono regulamin