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Process Flow, Mechanical
Process Flow, Mechanical
Applicable for W850 and W830
Contents
1
2
3
Process Flow, Mechanical................................................................................ 2
1.1
Process Flow Mechanical, Description.................................................. 3
Process Flow, Label.......................................................................................... 4
2.1
Process Flow Label, Description ........................................................... 5
Revision History ................................................................................................ 6
000 21-1/FEA 209 544/104 C
Company Internal
©
Sony Ericsson Mobile Communications AB
Process Flow, Mechanical
1 Process Flow, Mechanical
Unit in
No Trouble Found or
Softwere Fault
Determine
Fault
Liquid Intrusion
Control
Reject for
Customer
Abuse
Hardwere
Fault Found
Trouble Shoot
Fault not repairable on
this level or cause of
failure not found
Repair
Fault not repairable on
this level
Upgrade
Softwere to
Latest Revision
if Needed
Update Label
if Needed
Fail
Test
Pass
Unit Out
Next Repair
Level
000 21-1/FEA 209 544/104 C
Company Internal
©
Sony Ericsson Mobile Communications AB
2(6)
Process Flow, Mechanical
1.1
Process Flow Mechanical, Description
Box
Unit in
Determine fault
Reference
Process the phone according to local requirements.
Test Instruction, Mechanical
Determine if the phone is faulty or not, and try to confirm the
customer’s complaint. Only perform those tests necessary to
confirm the failure.
If a hardware fault is found, or a hardware and software fault is
found, then continue with
Trouble Shoot.
If only a software fault is found, then continue with
Upgrade
Software to Latest Revision, Test,
and
Unit Out.
Report as
SW upgrade.
If no hardware or software fault is found, then continue with
Upgrade Software to Latest Revision, Test,
and
Unit Out.
Report as
No Trouble Found, NTF.
If liquid intrusion or other abuse is found, then continue with
Reject for Customer Abuse.
Test Instruction, Mechanical
If liquid intrusion or abuse is found, then reject the product
according to local requirements.
Trouble Shooting Guide, Mechanical
Determine the cause of the failure. Trouble-shoot the phone
according to the guide for the most common faults.
Working Instruction, Mechanical
Repair the faulty phone according to the instruction. Replace
parts as required.
(Product Change Survey, Mechanical)
Flashing the latest software into the phone at this point may
“repair” some problems.
Product Change Survey, Mechanical
Upgrade the software to the latest revision if needed.
Working Instruction Mechanical
Print and apply a new label if needed.
Test Instruction, Mechanical
Perform all tests as described in the instruction.
Process and package the phone according to local
requirements.
If the cause of the failure cannot be found or is not reparable
at this level, then escalate the phone to the next repair level, or
return it to the customer at the customer’s request.
Report as
Escalate.
Reject for
Customer Abuse
Trouble shoot
Repair
Upgrade Software
to Latest Revision
if Needed
Update Label if
Needed
Test
Unit Out
Next Repair Level
000 21-1/FEA 209 544/104 C
Company Internal
©
Sony Ericsson Mobile Communications AB
3(6)
Process Flow, Mechanical
2 Process Flow, Label
000 21-1/FEA 209 544/104 C
Company Internal
©
Sony Ericsson Mobile Communications AB
4(6)
Process Flow, Mechanical
2.1
Process Flow Label, Description
Box
Read the old label
Print a new label
Reference
Use the
Label Make II
program; read the information on the
old label and use that as an input for the new label.
Print a new Label.
Continue with
Remove the old label.
Working Instructions
Remove the old label according to the instructions. Only one
label is allowed on the frame.
Continue with
Assemble a new label.
Working Instructions
Assemble the new label according to the instructions.
Remove the old
label
Assemble a new
label
000 21-1/FEA 209 544/104 C
Company Internal
©
Sony Ericsson Mobile Communications AB
5(6)

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