PROCESS FLOW.PDF

(181 KB) Pobierz
Process Flow, Electrical
Process Flow, Electrical
Applicable for Z300
Contents
1
2
Process Flow ..................................................................................................... 2
1.1
Process Flow, Description..................................................................... 3
Revision History ................................................................................................ 4
000 21-2/FEA 209 544/125 A
Company Internal
©
Sony Ericsson Mobile Communications AB
Process Flow, Electrical
1 Process Flow
Unit in
No Trouble
Found or
Software
Fault
Determine
Fault
Liquid Intrusion Control
Reject for
Customer Abuse
Hardware
Fault Found
Fault not repairable on this level
or cause of failure not found
Trouble Shoot
Fault not repairable on this level
Repair
Upgrade Software
to Latest Revision
if Needed
Update Label if
Needed
Test
Fail
Pass
Next Repair Level
Unit Out
000 21-2/FEA 209 544/125 A
Company Internal
©
Sony Ericsson Mobile Communications AB
2(4)
Process Flow, Electrical
1.1
Process Flow, Description
Reference
Process the phone according to local requirements.
Test Instruction, Mechanical and Electrical
Determine if the phone is faulty or not, and try to confirm the customer’s
complaint. Only perform those tests necessary to confirm the failure.
If a hardware fault is found, or a hardware and software fault is found,
then continue with
Trouble Shoot.
If only a software fault is found, then continue with
Upgrade Software to
Latest Revision, Test,
and
Unit Out.
Report as
SW upgrade.
If no hardware or software fault is found, then continue with
Upgrade
Software to Latest Revision, Test,
and
Unit Out.
Report as
No Trouble Found, NTF.
If liquid intrusion or other abuse is found, then continue with
Reject for
Customer Abuse.
Test Instruction, Mechanical
If liquid intrusion or abuse is found, then reject the product according to
local requirements.
Trouble Shooting Guide, Mechanical and Electrical
Determine the cause of the failure. Trouble-shoot the phone according to
the guide for the most common faults.
Working Instruction, Mechanical and Electrical
Repair the faulty phone according to the instruction. Replace parts as
required.
(Product Change Survey, Mechanical)
Flashing the latest software into the phone at this point may “repair” some
problems.
If a repair that requires calibration has been done, then calibrate the unit
in SERP.
(Test Instruction, Electrical)
Calibration can only be done by authorized repair locations.
Product Change Survey, Mechanical
Upgrade the software to the latest revision if needed.
Working Instruction Mechanical
Print and apply a new label if needed.
Test Instruction, Mechanical and Electrical
Perform all tests as described in the instruction.
Process and package the phone according to local requirements.
If the cause of the failure cannot be found or is not reparable at this level,
then the product can be Scrapped, Swapped, or returned to the customer
at the customer’s request.
Scrap:
According to local directives
Box
Unit in
Determine Fault
Reject for Customer
Abuse
Trouble Shoot
Repair
Upgrade Software to
Latest Revision if Needed
Update Label if Needed
Test
Unit Out
Next Repair Level
Swap: Swap the phone according to the instruction in
Working
Instructions, Swap and Customize
and according to local directives.
000 21-2/FEA 209 544/125 A
Company Internal
©
Sony Ericsson Mobile Communications AB
3(4)
Process Flow, Electrical
2 Revision History
Rev.
A
Date
2007-02-14
Changes / Comments
First release
000 21-2/FEA 209 544/125 A
Company Internal
©
Sony Ericsson Mobile Communications AB
4(4)

Plik z chomika:

Inne pliki z tego folderu:

Inne foldery tego chomika:

Zgłoś jeśli naruszono regulamin