3310_3330_repair_hints.pdf

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Customer Care Europe & Africa
SCCE Training Group
CONFIDENTIAL
NHM-5/6
Date 01.02.2002
1 (42)
Repairhints
Version 3.0 Approved
Repairhints
3310/3330
NHM-5/6
©
NMP 2002
Checked by:
Customer Care E&A
Approved by:
SCCE Training Group
Customer Care Europe & Africa
SCCE Training Group
CONFIDENTIAL
NHM-5/6
Date 01.02.2002
2 (42)
Repairhints
Version 3.0 Approved
GENERAL
- How to use this document
Put the QUICK REPAIR layouts behind this manual.
Now you are able to follow these specifications with graphical layouts and it is easier for you to find the components and
measuring points
.
- Component characteristics:
Some components contain important data.
Several described steps are only practicable if you are able to reflash/ realign the phone and/or rewrite IMEI/SIMlock in certain
cases. Please pay attention to separate notes.
It is not possible to change underfilled components. The trial will damage PCB surely.
All replaceable µBGA-components must be renewed after removing.
Check soldering points, remove oxidated solderings (broken balls) carefully by enclosing few new solder before placing new
components.
µBGA
must
be soldered only with NMP approved µBGA-rework machines (e.g. Zevac/OK International).
Soldering/Resoldering CSP´s with Hot Fan is strictly forbidden
Use only recommended Fluxtype and an appropriate amount of it.
- Underfills, broken balls, µBGA
- PCB handling & cleaning
Only use appropriate cleaning materials, do not use scratching or rubbing tools. Clean PCB carefully after every rework and take
great pains over the keyboard area. Do not make any loose wiring connections anywhere.
If it is necessary to clean the PCB, please pay attention to the following: Due to of organic surface protection (OSP), cleaning
must only be done with a lint-free cloth which may be moisten with DI-water. IPA or other solvent like ethanol should only be
used to clean gold pads for spring contacts without affecting the surrounding copper layers.
If it is necessary to change any item located under the metal shields, remove the shield first, don not cut partially or bend it.
- Realign after repair
Characteristics of replacement parts are different.
To prevent additional faults after repair (eg. low standby time, loosing network etc.) it is necessary
to retune phone values after repair.
©
NMP 2002
Checked by:
Customer Care E&A
Approved by:
SCCE Training Group
Customer Care Europe & Africa
SCCE Training Group
CONFIDENTIAL
NHM-5/6
Date 01.02.2002
3 (42)
Repairhints
Version 3.0 Approved
INTRODUCTION
IMPORTANT:
This document is intended for use by authorized NOKIA Service Centers only.
The purpose of this document is to provide some further service information for NOKIA 3310 / 3330 phones.
It contains a lot of collected tips and hints to find failures and repair solutions easily.
It also will give support to the inexperienced technicians.
Saving process time and improving the repair quality is the aim of using this document.
We have built it up based on fault symptoms (listed in "Contents") followed by detailed description for further analysis.
It is to be used additionally to the service manual and other service information like Service Bulletins. For that reason it does not
contain any circuit descriptions or schematics.
All measurements are made using following equipment:
Nokia repair SW
DLL version
Digital multimeter
Oscilloscope
Spectrum Analyzer
RF-Generator /
GSM Tester
While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If any errors are found by
the reader, NOKIA should be notified in writing, using following procedure:
Please state:
Title of the Document + Issue Number/Date of publication.
Page(s) and/or Figure(s) in error.
Please send to:
Nokia GmbH
SCCE Training Group
Customer Care E&A
Meesmannstr.103
D-44807 Bochum / Germany
Email: training.sace@nokia.com
: WinTesla Version 6.43
: 311.11.00 / 04.12.2001
: Fluke 73
: Hitachi V-1565; Fluke PM 3380A/B
: Advantest R3161 with an analogue probe
: Rohde & Schwarz CMU 200
Copyright © Nokia Mobile Phones.
This material, including documentation and any related computer programs, is protected by copyright, controlled by Nokia Mobile
Phones. All rights are reserved. Copying, including reproducing, modifying, storing, adapting or translating, any or all of this
material requires the prior written consent of Nokia Mobile Phones. This material also contains confidential information, which
may not be disclosed to others without the prior written consent of Nokia Mobile Phones.
©
NMP 2002
Checked by:
Customer Care E&A
Approved by:
SCCE Training Group
Customer Care Europe & Africa
SCCE Training Group
CONFIDENTIAL
NHM-5/6
Date 01.02.2002
4 (42)
Repairhints
Version 3.0 Approved
Contents
PREFACE
General
Introduction
List of flowcharts
List of figures
Important Information
AM Suppression tuning
2
2
3
6
6
7
8
CHAPTER 1
Difficulties when removing B-Cover (SB13 / NHM-5)
Intermittent switches off problem (SB 28 / NHM-5, SB 7 / NHM 6)
Different system modules with PCB-version UB4_10 in NHM-5 (SB 25)
HW – CHANGES
11
11
11
11
CHAPTER 2
Description step by step of changing the FLASH/EEPROM –combination D301
CHANGING OF D301
12-14
12
CHAPTER 3
CHAPTER 4
PHONE DOES NOT SWITCH ON
FLASH UPDATE NOT POSSIBLE
15-17
18
Failure message ”MCU boot failure,serial clock-/data line failure”
Failure message ”Algorithm code fail / alias ID missing”
Failure message ”External RAM failure”
19
19
19
CHAPTER 5
CHAPTER 6
PHONE SWITCHES OFF INTERMITTENT
LOW STANDBY / OPERATION MODE TIME
Low standby / operation time
Off state current fail
Sleep mode current fail
20
21
21-22
22
22
CHAPTER 7
NOT CHARGING
Not charging
Nothing happens if charger is connected
Display message “Not charging”
23
24
24
24
©
NMP 2002
Checked by:
Customer Care E&A
Approved by:
SCCE Training Group
Customer Care Europe & Africa
SCCE Training Group
CONFIDENTIAL
NHM-5/6
Date 01.02.2002
5 (42)
Repairhints
Version 3.0 Approved
CHAPTER 8
CONTACT SERVICE
MCU ROM Checksum failed
CCONT Interface failed
COBBA parallel/serial failed
DSP Alive test failed
EEPROM sec/tune checksum failed
25
25
25
25
25
25
CHAPTER 9
SIMCARD FAULTS
Display message “Insert SIMcard”
Display message ”SIMcard not accepted”
26
27
27
CHAPTER 10
INTERNAL AUDIO FAULTS
Speaker faulty
Microphone does not work
28
28
28
CHAPTER 11
USER INTERFACE FAULTY
Display failure
Keypad malfunction
Backlight failure
Vibra failure
Buzzer failure
Clock time problems
29
29
29
29
29
30
30
CHAPTER 12
NO SERVICE
No or too low TX power GSM 900
No or too low TX power GSM 1800
Faulty spectrum
No RX-calibration GSM 900 possible
No RX-calibration GSM 1800 possible
Poor service or no network coverage, C508 faulty
31-35
35
36
37-40
40
41
31
CHAPTER 13
CHANGE HISTORY
42
©
NMP 2002
Checked by:
Customer Care E&A
Approved by:
SCCE Training Group

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