Kopia Process_Flow.PDF

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Process Flow, Electrical
Process Flow, Electrical
Applicable for P990i
Contents
1
2
Process Flow, HVC............................................................................................ 2
1.1
Process Flow HVC, Description ............................................................ 3
Revision History ................................................................................................ 5
000 21-2/FEA 209 544/97 A
Company Internal
©
Sony Ericsson Mobile Communications AB
Process Flow, Electrical
1 Process Flow, HVC
Unit in
No Trouble
Found or
Software
Fault
Determine
Fault
Liquid Intrusion Control
Reject for
Customer Abuse
Hardware
Fault Found
Fault not repairable on this level
or cause of failure not found
Trouble Shoot
Fault not repairable on this level
Repair
Upgrade Software
to Latest Revision
if Needed
Update Label if
Needed
Test
Fail
Pass
Next Repair Level
1.1
Unit Out
000 21-2/FEA 209 544/97 A
Company Internal
©
Sony Ericsson Mobile Communications AB
2(5)
Process Flow, Electrical
Process Flow HVC, Description
Box
Unit in
Determine fault
Reference
Process the phone according to local requirements.
Test Instruction, Mechanical and Electrical
Determine if the phone is faulty or not, and try to confirm the
customer’s complaint. Only perform those tests necessary to
confirm the failure.
If a hardware fault is found, or a hardware and software fault is
found, then continue with
Trouble Shoot.
If only a software fault is found, then continue with
Upgrade
Software to Latest Revision, Test,
and
Unit Out.
Report as
SW upgrade.
If no hardware or software fault is found, then continue with
Upgrade Software to Latest Revision, Test,
and
Unit Out.
Report as
No Trouble Found, NTF.
If liquid intrusion or other abuse is found, then continue with
Reject for Customer Abuse.
Test Instruction, Mechanical
If liquid intrusion or abuse is found, then reject the product
according to local requirements.
Trouble Shooting Guide, Mechanical and Electrical
Determine the cause of the failure. Trouble-shoot the phone
according to the guide for the most common faults.
Working Instruction Mechanical and Electrical
Repair the faulty phone according to the instruction. Replace
parts as required.
(Product Change Survey, Mechanical)
Flashing the latest software into the phone at this point may
“repair” some problems.
If a repair that requires calibration has been done, calibrate the
unit in SERP.
(Test Instruction, Electrical)
Calibration can only be done by authorized repair
locations.
Reject for
Customer Abuse
Trouble shoot
Repair
SW upgrade to
latest revision if
needed
Update Label if
Needed
Test
Unit Out
Next Repair Level
Product Change Survey, Mechanical
Upgrade the software to the latest revision if needed.
Working Instruction Mechanical
Print and apply a new label if needed.
Test Instruction, Electrical
To verify that the phone works, all test actions must be
performed.
Process and package the phone according to local
requirements.
If the cause of the failure cannot be found or is not repairable
at this level, the phone can be Scrapped, Swapped or returned
3(5)
000 21-2/FEA 209 544/97 A
Company Internal
©
Sony Ericsson Mobile Communications AB
Process Flow, Electrical
to the customer at the customer’s request.
Scrap:
According to local directives
Swap:
Swap the phone according to the instruction in
Working
Instructions, Swap and Customize
and according to local
directives
000 21-2/FEA 209 544/97 A
Company Internal
©
Sony Ericsson Mobile Communications AB
4(5)
Process Flow, Electrical
2 Revision History
Rev.
A
Date
2006-07-20
Changes / Comments
Initial release
000 21-2/FEA 209 544/97 A
Company Internal
©
Sony Ericsson Mobile Communications AB
5(5)

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